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RUCHI ORGANICS LTD.
An ISO 9001:2008 Certified Company
Home » Products » Adhesives » Heat Sealing Adhesive

Heat Sealing Adhesive



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Product Code : 15

Product Specification
Water Base Copolymer - (Modibond E-60): It is used  for foil to paper (any type). This is a single component product used in dry laminated Machine.

Heat Sealing Adhesive: This is a VMCH base Adhesive to be applied on Paper or Aluminium Foil for heat sealing..

Top Coating - (Modibond TK30):  This is a Single Component P.U. base coating used online at the time of printing on paper. It gives shining as well as water resisting effect on the printed surface. This is a single component.

Modibond - 8000 / HR-7570 is a solvent based two component adhesive system consisting of a Polyester based Adhesive and an aromatic  Polyisocynate curing agent . MB 8000 is a general purpose adhesive having high bond strength and chemical resistance . It is suitable for laminating various  types of substrates such as  BOPP, LD , PET , FOIL , AND  paper to make laminates  suitable for packaging of snack foods and other non aggressive dry products.

Modibond-SL-100H/Modibond-SL-100R is a solvent less two component  system consisting of a polyurethane based  and a polyester based additive. It is suitable for the laminating various types of substrate such as PET , BOPP , LDPE , MET , FOIL & PAPER to make laminates for packaging of liquids ,spices or other aggressive volatiles . This  two component system offers excellent chemical and heat resistance after lamination

  Modibond Solvent Less P.U.: This is a solvent less Single  component Polyester Polyol  Resin specially developed for Paper application. It is suitable for the laminating various types of substrate such as PET , BOPP , LDPE , MET , FOIL to  PAPER only to make laminates for packaging of liquids ,spices or other aggressive volatiles. This  Single  component system offers excellent chemical and heat resistance after lamination. It can be used to make laminates for food  grade packaging.

Modibond LM-55  is Poly Vinyl Acetate Co-Polymer dispersion of low viscosity  &  mixed particle size. CP-55 has excellent adhesion on laminated surface to board.  The product is designated to be used on various types of lamination machines.  Being a water based adhesive, one of the substrates to be bonded should essentially be porous in nature & hence  LM - 55  gives excellent adhesion to porous substrates such as maplitho paper,  board, Chromo art  paper etc. to non-porous films such as polyester. PVC, BOPP etc.

Water Proofing
  • Modibond - Waterproofing SL is a solvent less  system consisting of polyurethane. It is suitable for various types of substract such as RCC, BRICK, CEMENT, PLASTER, MUD etc.  to make waterproof of  any liquids or other aggressive volatiles. This system offers excellent chemical and heat resistance after coating on the substract.
  • Modibond-PT-55 is a Co-polymer of  Butyl Acrylate base in Dispersion form. It is suitable for the manufacture of Waterproof Coating mixed with Portland Cement/Pigments  with good flow and setting properties.
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Polyurethane Resin
Polyurethane Resin
Maleic Resin
Maleic Resin
Industrial PU Resin
Industrial PU Resin
Polyvinyl Acetate Emulsion
Polyvinyl Acetate Emulsion
Sensitive Adhesives
Sensitive Adhesives
Heat Sealing Adhesive
Heat Sealing Adhesive
Acrylic Polymer Emulsions
Acrylic Polymer Emulsions
Solvent Cement
Solvent Cement
High Strength Epoxy Resin
High Strength Epoxy Resin
Synthetic Epoxy Resin
Synthetic Epoxy Resin
Crack Fill Resin
Crack Fill Resin
Granite Fill Resin
Granite Fill Resin
Polyester Epoxy Resins
Polyester Epoxy Resins
Heat Resistance Adhesive
Heat Resistance Adhesive
Synthetic Rubber Adhesive
Synthetic Rubber Adhesive
Synthetic Wood Adhesives
Synthetic Wood Adhesives
Epoxy Resin
Epoxy Resin
 
RUCHI ORGANICS LTD.
An ISO 9001:2008 Certified Company
26 A, Sarojini Nagar, Near Mariumpur Hospital Crossing, Kanpur - 208005, Uttar Pradesh, India
Phone : 91-512-2215068
Fax : 91-512-2217177
Mr. R. K. Seth

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